Ceramic substrates & hybrid circuits suppliers in Germany

A world leader in electronic solutions for the smart society

• Ceramic substrates & hybrid circuits
• Memory ICs
• Power management ICs
• Diodes & small-signal transistors
• Optoelectronic components

Your Global Partner for CUSTOMIZED MICROSYSTEMS & OPTOELECTRONICS

• Ceramic substrates & hybrid circuits
• MEMS & motion sensors
• SMT assembly
• THT assembly
• Microelectronics packaging

Precision Manufacturing Systems to create more powerful electronic systems.

• Ceramic substrates & hybrid circuits
• Circuit protection & EMC components
• EMI / ESD shielding
• Rigid PCBs
• HDI PCBs

Your One-Stop Service Partner for PCB Solutions and Electronics Manufacturing

• Ceramic substrates & hybrid circuits
• THT assembly
• HDI PCBs
• Rigid-flex PCBs
• High-frequency PCBs

Leading technologies in circuit protection, power control, and sensing

• Ceramic substrates & hybrid circuits
• Power management ICs
• Power semiconductors
• Diodes & small-signal transistors
• Logic ICs

Etched metal parts acc. to drawing, etching of strips (reel to reel production)

• Ceramic substrates & hybrid circuits
• Circuit protection & EMC components
• Connectors
• Thermal management
• EMI / ESD shielding

KERAFOL - makes electronics cool. Thermal Interface Materials Made in Germany

• Ceramic substrates & hybrid circuits
• Diodes & small-signal transistors
• Magnetic & ceramic components
• Thermal management
• Metal-plastic & hybrid parts

PCB Solutions for Automotive, Industrial and Power Electronics

• Ceramic substrates & hybrid circuits
• Rigid PCBs
• Flexible PCBs
• Metal-core & thermal PCBs
• Electronics assembly

We manufacture plastic-hybrid components and 3D-MID components.

• Ceramic substrates & hybrid circuits
• PCB connectors
• Enclosures & housings
• Position, distance & proximity sensors
• MEMS & motion sensors

IGF-Research at the intersection of mechanics, electronics and manufacturing

• Ceramic substrates & hybrid circuits
• Antennas
• PCB fabrication
• Injection moulding
• Printed & flexible electronics

The Fraunhofer-Gesellschaft is a leading applied research organization.

• Ceramic substrates & hybrid circuits
• Power management ICs
• IoT devices & gateways
• MEMS & motion sensors
• PCB fabrication

Innovative Electronics: Additive Manufacturing, 3D-MID, Power Electronics

• Ceramic substrates & hybrid circuits
• Metal-plastic & hybrid parts
• Printed & flexible electronics
• Power electronics & energy
• AI & machine learning

Deep-drawing, stamping, assembly: efficient production and more

• Ceramic substrates & hybrid circuits
• Stamped & formed metal parts
• Plastic & rubber moulded parts
• Semi-finished materials
• Automotive