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Profile updated 30 Sept 2026

Friedrich-Alexander-Universität Erlangen-Nürnberg Lehrstuhl FAPS

Research instituteLocations reported in Germanywww.faps.tf.fau.de/
electronica 2026
10 Nov
B3.400
Unclaimed profile

About

Innovative Electronics: Additive Manufacturing, 3D-MID, Power Electronics

The Institute for Factory Automation and Production Systems (FAPS) at FAU develops cutting-edge manufacturing technologies for electronics production in three key areas: In SMT and THT manufacturing, we conduct research on AI-supported process optimization, multi-agent systems, and federated learning for autonomous, data-driven production. In the field of power electronics, we are developing additive processes such as laser powder deposition welding for 3D ceramic substrates and flexible assembly concepts for power modules. In the 3D-MID sector, we combine additive manufacturing with selective metallization, e.g. for microsatellites and radar applications. We utilize state-of-the-art analytics and digitalization to make electronics production more efficient, sustainable, and resilient.

Products

3 listed

Metal-plastic & hybrid parts

Source & evidence

Trade-fair listing
EMS electronic manufacturing services > Hybrid components / assemblies > Metal-ceramic hybrids [crosswalk: EMS electronic manufacturing services > Hybrid components / assemblies]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Ceramic substrates & hybrid circuits

Source & evidence

Trade-fair listing
PCBs and other circuit carriers > Injection molded circuits, MID / 3D-MID > MID components, other [crosswalk: PCBs and other circuit carriers > Injection molded circuits, MID / 3D-MID]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Semiconductors

Source & evidence

Trade-fair listing
Semiconductors > Printed, flexible semiconductors [crosswalk: Semiconductors > Printed, flexible semiconductors]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Locations & websites

1 location · 1 website

Company websites

Key capabilities

CapabilityDocumented scopeSupporting source
Printed & flexible electronicsListed capability; detailed scope not provided.
Source & evidence

Trade-fair listing
EMS electronic manufacturing services > EMS (component / chip carrier manufacturing) > Manufacturing processes for printed, flexible electronics > Laser processes [crosswalk: EMS electronic manufacturing services > EMS (component / chip carrier manufacturing) > Manufacturing processes for printed, flexible electronics]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Injection mouldingListed capability; detailed scope not provided.
Source & evidence

Trade-fair listing
PCBs and other circuit carriers > Injection molded circuits, MID / 3D-MID > MID components, other [crosswalk: PCBs and other circuit carriers > Injection molded circuits, MID / 3D-MID]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Industries served

Power electronics & energy

Source & evidence

Trade-fair listing
Power Electronics and Energy Technology (PE) [crosswalk: Power Electronics and Energy Technology (PE)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Evidence & freshness

Every claim keeps its source. Company-reported information and independent verification are labelled separately.

Source & evidence

Trade-fair listing
AI & Machine Learning (AI) [crosswalk: AI & Machine Learning (AI)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
Power Electronics and Energy Technology (PE) [crosswalk: Power Electronics and Energy Technology (PE)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
EMS electronic manufacturing services > EMS (component / chip carrier manufacturing) > Manufacturing processes for printed, flexible electronics > Laser processes [crosswalk: EMS electronic manufacturing services > EMS (component / chip carrier manufacturing) > Manufacturing processes for printed, flexible electronics]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
PCBs and other circuit carriers > Injection molded circuits, MID / 3D-MID > MID components, other [crosswalk: PCBs and other circuit carriers > Injection molded circuits, MID / 3D-MID]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
EMS electronic manufacturing services > Hybrid components / assemblies > Metal-ceramic hybrids [crosswalk: EMS electronic manufacturing services > Hybrid components / assemblies]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
PCBs and other circuit carriers > Injection molded circuits, MID / 3D-MID > MID components, other [crosswalk: PCBs and other circuit carriers > Injection molded circuits, MID / 3D-MID]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
Semiconductors > Printed, flexible semiconductors [crosswalk: Semiconductors > Printed, flexible semiconductors]
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
Germany
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026

Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026

What to confirm

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Research instituteSee supporting sources
Order quantity & lead timeConfirm directly with the supplier

Get in touch

Company contactjan-niklas.slama@faps.fau.de
Contact sources

electronica 2026 exhibitor directory · 26 Sept 2026

Company contactmanuela.ockel@faps.fau.de
Contact sources

electronica 2026 exhibitor directory · 26 Sept 2026

Elsewhere online

LinkedIn

YouTube

Meet them at

electronica 202610 Nov 2026 · MunichBooth B3.400

Still to confirm

Services and capabilities: not confirmed

Certifications: not confirmed

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