{"schemaVersion":1,"url":"https://b2bfinder.monemetrics.com/companies/set-corporation-s-a","json":"https://b2bfinder.monemetrics.com/companies/set-corporation-s-a.json","updatedAt":"2026-09-30T18:22:15.546Z","indexable":true,"company":{"name":"SET Corporation S.A.","country":"France","countryCode":"FR","website":"https://www.set-sas.fr","websites":["https://www.set-sas.fr/"],"links":[{"network":"LinkedIn","url":"https://www.linkedin.com/company/set-corporation/"},{"url":"https://www.youtube.com/channel/UCKBHfKCPZh22ReChHqlt5BA","network":"YouTube"}],"shortDescription":"World leading supplier of Flip-Chip Bonders excelling in high-end applications","description":"Based in France, we are a world leading supplier of Flip-Chip Bonders excelling in high-end, demanding applications.Since 1975, we have accompanied laboratories and industries, which look for a high precision and an important reliability in the assembly of their components. We accelerate their developments of the chips of future thanks to our robust and precise Flip-Chip Bonders.With Flip-Chip Bonders installed worldwide, we are globally renowned for the high post-bond sub-micron accuracy and the high flexibility of our equipment.Ranging from manual loading version to fully automated version, our systems cover a wide range of applications and offer the unique ability to handle both fragile and small components onto substrates and wafers up to 300 mm.","profileStatus":"public_unclaimed"},"capabilities":{"product":[{"slug":"product.production_equipment.packaging_equipment","label":"Packaging & assembly equipment (microelectronics)","strongestEvidence":"Trade-fair listing","evidence":[{"level":"event_organiser_source","label":"Trade-fair listing","detail":"SEMICON Europa > Packaging and Assembly Equipment > Die Bonding","source":{"title":"electronica 2026 exhibitor directory","url":"https://exhibitors.electronica.de/exhibitor-portal/2026/list-of-exhibitors/exhibitordetails/set-corporation-sa/","checkedAt":"2026-09-26"}}]}]},"products":[],"services":[],"events":[{"name":"electronica 2026","startsOn":"2026-11-10","endsOn":"2026-11-13","status":"upcoming","venue":"Messe München","city":"Munich","booths":["B1.456"],"website":"https://electronica.de"}],"locations":[{"address":"131 Impasse Barteudet, 74490 Saint-Jeoire, France","city":"Saint-Jeoire","country":"France","countryCode":"FR"}],"contacts":[],"news":[],"unknown":["process","capability","certification","org_type"],"similarSuppliers":[{"label":"France","count":102,"url":"https://b2bfinder.monemetrics.com/suppliers/in/france"},{"label":"Packaging & assembly equipment (microelectronics)","count":45,"url":"https://b2bfinder.monemetrics.com/suppliers/packaging-and-assembly-equipment-microelectronics"}]}