ProSys specializes in megasonics for wet single wafer and batch applications.
ProSys is the leading specialist in megasonic enhanced processing for single wafer and batch applications.• FEOL/BEOL cleaning• Megasonic performance boost for existing nozzle-applications• Contactless Edge Bevel Cleaing• Post-CMP-, Pre-Bond-, and Mask cleaning• TSV/VIA cleaning• Fragile MEMS cleaning: Gentle and highly efficient• Resist Strip/Develop• Metal Lift-Off• Post-Dicing cleaning (Saw, Laser, Plasma)Parameters of all ProSys systems are measured and controlled in real-time. Our MegPie™ is the industrystandard for sub 20 nm cleaning in high volume device manufacturing thanks to an unmatched cleaningefficiency and uniformity.Our direct batch systems run without active cooling and help increase cleaning efficiency, throughput, andreduce tool downtime.
Products
2 listed
Packaging & assembly equipment (microelectronics)
Source & evidence
Trade-fair listing SEMICON Europa > Packaging and Assembly Equipment > Cleaning [crosswalk: SEMICON Europa > Packaging and Assembly Equipment] electronica 2026 exhibitor directory Checked 26 Sept 2026
Semiconductor & wafer process equipment
Source & evidence
Trade-fair listing SEMICON Europa > Process Equipment > Chemical Mechanical Polishing (CMP) [crosswalk: SEMICON Europa > Process Equipment] electronica 2026 exhibitor directory Checked 26 Sept 2026