Equipment Manufacturing & Services for Microelectronics and Advanced Packaging
PacTech – Packaging Technologies, is a leading provider of laser assisted bonding, laser assisted reflow and solder balling/jetting equipment as well as wet chemical plating lines. The company also offers plating chemistries and high-volume subcontractor bumping and die preparation services for semiconductors, catering to diverse applications in consumer electronics, automotive, aerospace, sensors, MEMS, RF, and AI technologies. With manufacturing facilities in Germany (HQ), the USA, and Malaysia, PacTech is well-positioned to support the evolving needs of the semiconductor industry worldwide.
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Am Schlangenhorst 7-9, 14641 Nauen, Germany
Nauen, Germany
Trade-fair listing
Germany
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Detailed capabilities haven’t been provided.
Trade-fair listing
Consumer electronics (CO) [crosswalk: Consumer electronics (CO)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
Electronics for aviation, aerospace and defence (D) [crosswalk: Electronics for aviation, aerospace and defence (D)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
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Trade-fair listing
Consumer electronics (CO) [crosswalk: Consumer electronics (CO)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
Electronics for aviation, aerospace and defence (D) [crosswalk: Electronics for aviation, aerospace and defence (D)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
Germany
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026
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