OEG GmbH

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Metrology equipment for wafer processing: contact angle, thin-film stress, EBR

Since 1991, OEG GmbH has been developing and manufacturing high-precision optical measurement systems for optical, physical, and geometric parameters.1. Contact angle measurement systemsThese systems are available with various levels of automation, ranging from manual to fully automatic. The SURFTENS WH 300 is the flagship model, equipped with a wafer robot, load port, and SECS/GEM interface.2. Edge Bead Removal (EBR) measurementSemi-automatic and fully automatic solutions for EBR measurement are available, including options combined with contact angle measurement.3. Flatscan thin-film stress measurement systemOptical measurement systems for wafer surface profiling used to calculate thin-film stress.4. MR200 precision scribing system for SEM sample preparation