Solder, adhesives & tapes
Source & evidence
Trade-fair listing
SEMICON Europa > Packaging and Assembly Materials > Packages [crosswalk: SEMICON Europa > Packaging and Assembly Materials]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Diamond Thermal Solutions for the Future of Electronics
Jiangsu Jingkun Technology Co., Ltd. specializes in the development and manufacturing of diamond-based metal composite materials for thermal management applications.By combining the outstanding thermal conductivity of diamond with the advantages of metal materials, we provide high-performance diamond copper and diamond aluminum composites featuring excellent thermal conductivity, low thermal expansion, lightweight structure and high reliability.Our products are widely used in semiconductor packaging, high-power electronics, AI computing, 5G communication, laser devices and power electronics. With advanced material technology and precision manufacturing capabilities, Jingkun Technology delivers reliable thermal solutions to support the development of next-generation electronic systems.
Trade-fair listing
SEMICON Europa > Packaging and Assembly Materials > Packages [crosswalk: SEMICON Europa > Packaging and Assembly Materials]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
SEMICON Europa > Process Materials > Process Chamber Components [crosswalk: SEMICON Europa > Process Materials]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
SEMICON Europa > Substrates > Diamond substrates [crosswalk: SEMICON Europa > Substrates]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
No.888, Binjiang West Road, Ligang Street, Jiangyin City, 214400 Changzhou, China
Changzhou, China
Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
China
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Detailed capabilities haven’t been provided.
Trade-fair listing
SEMICON Europa > Electronic Applications > Energy Efficiency: Power electronics [crosswalk: SEMICON Europa > Electronic Applications]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
5G/6G (G) [crosswalk: 5G/6G (G)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
Electronics for aviation, aerospace and defence (D) [crosswalk: Electronics for aviation, aerospace and defence (D)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Every claim keeps its source. Company-reported information and independent verification are labelled separately.
Trade-fair listing
SEMICON Europa > Electronic Applications > Energy Efficiency: Power electronics [crosswalk: SEMICON Europa > Electronic Applications]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
5G/6G (G) [crosswalk: 5G/6G (G)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
Electronics for aviation, aerospace and defence (D) [crosswalk: Electronics for aviation, aerospace and defence (D)]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
SEMICON Europa > Packaging and Assembly Materials > Packages [crosswalk: SEMICON Europa > Packaging and Assembly Materials]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
SEMICON Europa > Process Materials > Process Chamber Components [crosswalk: SEMICON Europa > Process Materials]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
SEMICON Europa > Substrates > Diamond substrates [crosswalk: SEMICON Europa > Substrates]
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
China
electronica 2026 exhibitor directory
Checked 26 Sept 2026
Trade-fair listing
electronica 2026 exhibitor directory
Checked 26 Sept 2026
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