{"schemaVersion":1,"url":"https://b2bfinder.monemetrics.com/companies/disco-hi-tec-europe-gmbh","json":"https://b2bfinder.monemetrics.com/companies/disco-hi-tec-europe-gmbh.json","updatedAt":"2026-09-30T18:21:45.211Z","indexable":true,"company":{"name":"DISCO HI-TEC EUROPE GmbH","role":{"key":"contract_manufacturer","label":"Contract manufacturer (EMS)"},"country":"Germany","countryCode":"DE","links":[{"network":"LinkedIn","url":"https://www.linkedin.com/company/disco-hi-tec-europe-gmbh"}],"shortDescription":"Total solutions for dicing, grinding and polishing of semiconductor wafers","description":"DISCO is a leading solution provider for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies. We develop and manufacture precision dicing, grinding and polishing machines as well as dicing blades and grinding/polishing wheels. Ablation laser and stealth laser dicing saws, plasma processing and tape mounting equipment are also available from us. Our unique advantage is that we can provide you with not only machines and consumables, but also the total process solutions based on our wide range of application experiences. Dicing-Grinding Service and Camtek optical inspection service (AOI) are available in our cleanrooms in Munich.","profileStatus":"public_unclaimed"},"capabilities":{"application":[{"slug":"application.semiconductor_fab","label":"Semiconductor manufacturing","strongestEvidence":"Trade-fair listing","evidence":[{"level":"event_organiser_source","label":"Trade-fair listing","detail":"SEMICON Europa > Manufacturing Services > Sawing","source":{"title":"electronica 2026 exhibitor directory","url":"https://exhibitors.electronica.de/exhibitor-portal/2026/list-of-exhibitors/exhibitordetails/disco-hi-tec-europe-gmbh/","checkedAt":"2026-09-26"}}]}],"product":[{"slug":"product.production_equipment","label":"Production equipment & automation","strongestEvidence":"Trade-fair listing","evidence":[{"level":"event_organiser_source","label":"Trade-fair listing","detail":"SEMICON Europa > Other Equipment > Cutting","source":{"title":"electronica 2026 exhibitor directory","url":"https://exhibitors.electronica.de/exhibitor-portal/2026/list-of-exhibitors/exhibitordetails/disco-hi-tec-europe-gmbh/","checkedAt":"2026-09-26"}}]},{"slug":"product.production_equipment.packaging_equipment","label":"Packaging & assembly equipment (microelectronics)","strongestEvidence":"Trade-fair listing","evidence":[{"level":"event_organiser_source","label":"Trade-fair listing","detail":"SEMICON Europa > Packaging and Assembly Equipment > Backgrind","source":{"title":"electronica 2026 exhibitor directory","url":"https://exhibitors.electronica.de/exhibitor-portal/2026/list-of-exhibitors/exhibitordetails/disco-hi-tec-europe-gmbh/","checkedAt":"2026-09-26"}}]}]},"products":[],"services":[],"events":[{"name":"electronica 2026","startsOn":"2026-11-10","endsOn":"2026-11-13","status":"upcoming","venue":"Messe München","city":"Munich","booths":["B1.201"],"website":"https://electronica.de"}],"locations":[{"address":"Liebigstrasse 8, 85551 Kirchheim b. München, Germany","city":"Kirchheim b. München","country":"Germany","countryCode":"DE"}],"contacts":[],"news":[],"unknown":["process","capability","certification"],"similarSuppliers":[{"label":"Germany","count":963,"url":"https://b2bfinder.monemetrics.com/suppliers/in/germany"},{"label":"Packaging & assembly equipment (microelectronics) in Germany","count":24,"url":"https://b2bfinder.monemetrics.com/suppliers/packaging-and-assembly-equipment-microelectronics/in/germany"},{"label":"Production equipment & automation in Germany","count":169,"url":"https://b2bfinder.monemetrics.com/suppliers/production-equipment-and-automation/in/germany"},{"label":"Semiconductor manufacturing in Germany","count":105,"url":"https://b2bfinder.monemetrics.com/suppliers/semiconductor-manufacturing/in/germany"}]}