DISCO HI-TEC EUROPE GmbH

About

Total solutions for dicing, grinding and polishing of semiconductor wafers

DISCO is a leading solution provider for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies. We develop and manufacture precision dicing, grinding and polishing machines as well as dicing blades and grinding/polishing wheels. Ablation laser and stealth laser dicing saws, plasma processing and tape mounting equipment are also available from us. Our unique advantage is that we can provide you with not only machines and consumables, but also the total process solutions based on our wide range of application experiences. Dicing-Grinding Service and Camtek optical inspection service (AOI) are available in our cleanrooms in Munich.