About
Thermal Management Solutions for High-Performance Electronic Applications
THERMAL MANAGEMENT SOLUTIONSThermal solutions designed to reduce the operating temperatures of electronic components, improve thermal efficiency, and enhance system reliability in demanding environments.Product InnovationsTHERMAL PREPREGS:• BOND SHEET GLASS FREE: 2,0 - 3,2 - 4,0 - 5,0 - 8,0 - 10,0 W/m·K• BOND SHEET GLASS REINFORCED: 2,2 - 3,2 W/m·K• 20 µm ULTRATHIN GLASS FREE PREPREG: 1,0WTHERMAL FR4:• THIN LAM: 2,2W - 3,2 WIMS: METAL CLAD:• COBRITHERM HTC COPPER BASE: 2,2W - 3,2W - 4,0W - 5,0W - 8,0W - 10,0W• COBRITHERM HTC ULTRATHIN: 1,0W - 2,0W - 3,2W - 4,0W - 5,0W - 8,0W - 10,0W• FLEXTHERM & FASTHERM: 0,7W
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1 location · 1 websiteMontcada i Reixac, Spain
Avenida la Ferrería 76-78 · Polígono Industrial la Ferrería, 08110 Montcada i Reixac, Spain
Montcada i Reixac, Spain
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electronica 202610 Nov 2026 · MunichBooth A2.543
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